Ukuvimbela amanzi kanye nomswakama wokufakazela ikhishi, indlu yokugezela, i-balcony, uphahla nokunye.
Ukunqanda ukuvuleka kwedamu, umbhoshongo wamanzi, ithange lamanzi, ichibi lokubhukuda, ukugeza, ichibi lomthombo, ichibi lokuhlanza indle kanye nomsele wokunisela.
Ukuvimbela ukuvuza nokunqanda ukugqwala kwendawo engaphansi enomoya, umhubhe ongaphansi komhlaba, umthombo ojulile kanye nepayipi elingaphansi komhlaba nokunye.
Ukufaka isibopho nomswakama kwazo zonke izinhlobo zamathayela, imabula, ukhuni, i-asbestos nokunye.
Zonke izakhiwo zomkhiqizo kanye nemininingwane yohlelo lokusebenza esekelwe olwazini iqinisekiswa ukuthi ithembekile futhi inembile.Kodwa usadinga ukuhlola impahla nokuphepha kwayo ngaphambi kokufaka isicelo.Zonke izeluleko esizihlinzekayo azikwazi ukusetshenziswa kunoma yiziphi izimo.
I-CHEMPU ayenzi isiqinisekiso sanoma yiziphi ezinye izinhlelo zokusebenza ngaphandle kwencazelo kuze kube i-CHEMPU inikezela ngesiqinisekiso esibhaliwe esikhethekile.
I-CHEMPU inomthwalo wemfanelo kuphela wokubuyisela noma ukubuyisela imali uma lo mkhiqizo unesici phakathi nesikhathi sewaranti esishiwo ngenhla.
I-CHEMPU ikubeka kucace ukuthi ngeke ibhekane nanoma yiziphi izingozi.
IMPAHLA JWS-001 | |
Ukubukeka | Okumhlophe, Okumpunga I-Uniform Sticky Liquid |
Ukuminyana (g/cm³) | 1.35±0.1 |
Isikhathi samahhala se-Tack (Amaminithi) | 40 |
I-Adhesion Elongation | >300 |
Amandla Okuqina (Mpa) | >2 |
Isivinini Sokwelapha (mm/24h) | 3; 5 |
I-Elongation at Break (%) | ≥1000 |
Okuqukethwe okuqinile (%) | 99.5 |
Izinga Lokushisa Lokusebenza ( ℃) | 5-35 ℃ |
Izinga Lokushisa Lesevisi ( ℃) | -40~+120 ℃ |
Impilo Yeshelufu (Inyanga) | 12 |
Isitoreji Qaphela
1.Ivalwe futhi igcinwe endaweni epholile neyomile.
2.Kuphakanyiswa ukuthi igcinwe ku-5 ~ 25 ℃, futhi umswakama ungaphansi kuka-50% RH.
3.Uma izinga lokushisa lingaphezu kuka-40 ℃ noma umswakama ungaphezu kuka-80% RH, impilo yeshalofu ingase ibe mfushane.
Ukupakisha
20kg/Pail, 230kg/Drum
Ukulungiselela Ukusebenza
1. Amathuluzi: Ibhodi lepulasitiki elihlukanisiwe, ibhulashi, imiphongolo yepulasitiki, ama-electronics angu-30Kg, amagilavu enjoloba namathuluzi okuhlanza njenge-blade .etc.
2. Izidingo zemvelo:Izinga lokushisa ngu-5~35 C kanti umswakama ngu-35 ~ 85%RH.
3. Ukuhlanza: I-substrate surface kumele iqine, yome futhi ihlanzeke.Okufana nokungabi nothuli, amafutha, itiyela, itiyela, upende, ingcina, ukugqwala, ukuxosha amanzi, i-ejenti yokwelapha, i-ejenti ehlukanisayo nefilimu.Ukuhlanza ubuso kungabhekwana nakho ngokususa, ukuhlanza, ukufutha, nokunye.
4.Yenza i-substrate surface level:Uma kunemifantu endaweni engaphansi kwe-substrate, isinyathelo sokuqala ukuyigcwalisa, futhi indawo kufanele ilinganiswe.Ukusebenza ngemuva kokwelashwa kwe-sealant okungaphezu kuka-3mm.
5.Isilinganiso sethiyori: 1.0mm ubukhulu, 1.3 Kg / ㎡ enamathela edingekayo.
Ukusebenza
Isinyathelo sokuqala
Ukuxubha ingxenye njengekhona, izimpande zamashubhu.Lapho kusebenza, Kufanele kubhekwe ngobukhulu, ukuma kanye nendawo yendawo yokwakha.
Isinyathelo Sesibili
I-Symmetrical scraping.Ubukhulu obuhle kakhulu bokumboza abukho ngaphezu kuka-2mm ukuvimbela ama-bubbles.
Ukuvikelwa:
Uma kunesidingo, ungqimba oluvikelayo olufanele lungasetshenzwa phezu kwengubo
Ukunaka ukusebenza
Gqoka izingubo ezifanele zokuzivikela, amagilavu kanye nokuvikela amehlo/ubuso.Ngemva kokuxhumana nesikhumba, geza ngokushesha ngamanzi amaningi nensipho.Uma kwenzeka ingozi noma uzizwa ungaphilile, funa iseluleko sezokwelapha ngokushesha.